| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve a major drawback that occurs as production of an electronic device is not temporally separated from production of an electronic card mounted with the electronic device, in a method of manufacturing the electronic card. <P>SOLUTION: In the method of manufacturing the electronic card, prior to the production of an electronic card, that is, before a solid layer and other materials that constitute a body of the electronic card are mounted, an electronic assembly or an electronic device is manufactured first which is formed of: at least a first electronic unit that is provided in a window in the solid layer of the electronic card; and a second electronic unit that is arranged in an inner layer or the body of the electronic card. Accordingly, the electronic device mounted in each electronic card is manufactured in a preliminary step in accordance with a conventional process. To implement the preliminary step, a protection film constitutes several parts or one part that has at least one slit. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
