| 摘要 |
A leadframe of a metal foil has a die paddle for supporting a semiconductor die, an outer frame connected to the die paddle by a die paddle support, and a conductor lead connected to the outer frame, extending toward the die paddle and terminating at a distal end proximal to the die paddle. The conductor lead has a wedgepad formed at its distal end, and the wedgepad has a thickness substantially less than the thickness of the remaining portions of the conductor lead. A semiconductor die may be supported on the die paddle and a wire may connect to the wedgepad to a bond pad on the semiconductor die. An encapsulating material may encapsulate a portion of the leadframe, the wedgepad, the semiconductor die and the wire. |
