HEAT SPREADING PRINTED-CIRCUIT-BOARD AND METHOD FABRICATING THE SAME

摘要

PURPOSE: A heat dissipating printed circuit board and a manufacturing method thereof are provided to enhance the heat dissipation characteristic by forming a copper clad layer or a coating layer at an upper part of a circuit pattern and forming a copper plate layer for protecting the coating layer. CONSTITUTION: A heat dissipation printed circuit board, having a three layer heat dissipation structure, includes a copper clad laminated board(10), a heat dissipation coating layer(30) and a copper plate layer(40). The heat dissipation layer, formed at an upper part of the copper clad laminated board, includes gaphene. The copper plate layer is formed at an upper part of the heat dissipation coating layer.