| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the following problem: gold-tin eutectic bonding is unstable when a semiconductor light-emitting element having an Au bump formed on a semiconductor layer by electrolytic plating and an Sn layer further formed thereon is flip-chip mounted on a circuit board with a gold finish. <P>SOLUTION: In the semiconductor light-emitting element 10, an Au bump 46, an Sn layer 47 and an Au layer 48 are laminated on a bump 14 from the semiconductor side. As a result, oxidation of the Sn layer is prevented, and Au is uniformly spread, whereby the eutectic bonding is stabilized. <P>COPYRIGHT: (C)2011,JPO&INPIT |
