| 摘要 |
PROBLEM TO BE SOLVED: To suppress the durability of a shielding member from deteriorating. SOLUTION: A circuit module 1 includes: a substrate 10 having an electronic component mounting surface 10a; an electronic component group 11 mounted on the electronic component mounting surface 10a; a first mold resin 12 as a first sealing member for covering the electronic component group 11; a plated layer 13 as a shield member covering the first mold resin 12, and at the same time, brought into contact with the substrate 10; and a second mold resin 14 as a second sealing member sandwiching a substrate contact part 13a of the portion of the plated layer 13 which is brought into contact with the substrate 10 with the substrate 10 and covering at least a part of the plated layer 13. COPYRIGHT: (C)2011,JPO&INPIT |
