发明名称 |
HIGH SPEED CURING HALOGEN FREE ADHESIVE COMPOSITION, COVERLAY FILM AND ADHESIVE FILM USING THE SAME |
摘要 |
<p>PURPOSE: A halogen-free quick-hardening adhesive composition is provided to avoid the generation of gases harmful to the human body since a halogen is not included and to ensure excellent fire retardancy, low hardening temperature, and short hardening time. CONSTITUTION: A halogen-free quick-hardening adhesive composition comprises 100 parts by weight of a halogen-free epoxy resin, 30-90 parts by weight of a thermoplastic resin, 5-60 parts by weight of a hardener for epoxy, 1-50 parts by weight of benzoxazine, and 5-100 parts by weight of a phosphorous-based flame retardant represented by chemical formula 1. A cover lay film includes a pressure-sensitive adhesive layer formed by applying the halogen-free adhesive composition to an electric insulating film and a release substrate laminated on the adhesive layer.</p> |
申请公布号 |
KR20110080424(A) |
申请公布日期 |
2011.07.13 |
申请号 |
KR20100000631 |
申请日期 |
2010.01.05 |
申请人 |
TORAY ADVANCED MATERIALS KOREA INC. |
发明人 |
MOON, KI JEONG;JEON, HAE SANG;BAE, YEON UNG |
分类号 |
C09J163/00;C09J7/02;C09J121/00;H01L21/56 |
主分类号 |
C09J163/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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