发明名称 Electrical circuit with heat sink
摘要 <p>An electrical circuit includes a printed circuit board (12) for mounting circuit components (C) with an electrical connection line (14) extending over a given connection path (140, 142, 144). There is provided a heat sink (14) to dissipate the heat produced by said components (C), which is comprised of a shaped sheet-like body extending orthogonal to said printed circuit board (12) and having a shape at least partly (140, 142) reproducing said given connection path (140, 142, 144). The heat sink can also ensure the electrical connection of the components (C). </p>
申请公布号 EP2323465(A8) 申请公布日期 2011.07.13
申请号 EP20100177982 申请日期 2010.09.21
申请人 OSRAM GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG;OSRAM S.P.A. - SOCIETA' RIUNITE OSRAM EDISON CLERICI 发明人 PIVA, RAFFAELE
分类号 H05K1/02 主分类号 H05K1/02
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