METHOD OF PROCESSING A WAFER, WAFER TRANSFER ROBOT USED FOR PERFORMING THE SAME AND APPARATUS FOR PERFORMING THE SAME

摘要

PURPOSE: A method of processing a wafer, a wafer transfer robot used for performing the same and an apparatus for performing the same are provided to prevent water stain on a wafer due to natural drying by maintaining a wafer sufficiently wet while the wafer is transferred from a first module to a second module. CONSTITUTION: In a method of processing a wafer, a wafer transfer robot used for performing the same and an apparatus for performing the same, a wafer is etched or cleaned in a first module(100). A wet solution is proved to the wafer to maintain the surface of the wafer wet. The wafer is transferred to a second module(300) to be dried, and then the wafer is dried.