| 摘要 |
A circuit device exhibiting excellent heat radiation properties and a manufacturing method thereof are hereby provided. A circuit device comprises a circuit board, an insulating layer formed on the circuit board, a conductive pattern formed on the insulating layer, a circuit element electrically connected to the conductive pattern, wherein a protrusion partially extending and being buried in the insulating layer is provided on the circuit board. Accordingly, heat generated inside the device can be efficiently discharged to the exterior via the protrusion. |
