发明名称 |
SUPPORTING BODY FOR A SEMICONDUCTOR COMPONENT, SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCTION OF A SUPPORTING BODY |
摘要 |
A carrier body for a semiconductor component, in particular for an optoelectronic semiconductor component, is specified. Said carrier body has a connecting layer and a conductor layer, which are connected to one another via main areas facing one another. The connecting layer, the conductor layer or both the connecting layer and the conductor layer has/have at least one thinned region in which the layer thickness of said layer(s) is less than the maximum layer thickness of said layer(s). The connecting layer is either completely electrically conductive and electrically insulated at least from parts of the conductor layer or it is electrically insulating at least in parts. Furthermore, a semiconductor component comprising the electrical connection conductor and also a method for producing the carrier body are specified. |
申请公布号 |
KR20110081306(A) |
申请公布日期 |
2011.07.13 |
申请号 |
KR20117011950 |
申请日期 |
2009.10.22 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
ZITZLSPERGER MICHAEL;MUTZEL STEFANIE |
分类号 |
H01L23/495;H01L31/0203;H01L33/48 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|