COPPER ALLOY MATERIAL, ELECTRIC AND ELECTRONIC PARTS, AND COPPER ALLOY MATERIAL MANUFACTURING METHOD

摘要

A copper alloy material, having an alloy composition containing any one or both of Ni and Co in an amount of 0.4 to 5.0 mass% in total, and Si in an amount of 0.1 to 1.5 mass%, with the balance being copper and unavoidable impurities, wherein a ratio of an area of grains in which an angle of orientation deviated from S-orientation {2 3 1} <3 4 6> is within 30° is 60% or more, according to a crystal orientation analysis in EBSD measurement; an electrical or electronic part formed by working the copper alloy material; and a method of producing the copper alloy material.