<p>PURPOSE: A lead frame is provided to simplify a production process and to reduce a production cost by reducing the number of wires for electric connection of a semiconductor chip. CONSTITUTION: A part of plural internal leads(120) are connected to neighboring internal lead, and remaining internal leads are connected to a dye pad(110) or connected to non-neighboring internal leads. A plurality of semiconductor chips(140) mounts on the dye pad. The semiconductor chips are connected to other semiconductor chips or the internal leads via a wire(142).</p>
