发明名称 Socket for testing semiconductor package
摘要 A socket adapted for electrically connecting a semiconductor package to a printed circuit board, includes a main body defining a number of contact passageways and a plurality of contacts received in the contact passageways of the main body. Each contact has a base portion, a first contacting portion and a second contacting portion upwardly extending from the base portion, and a spring arm bent from a bottom edge of the base portion. The spring arm extends substantially in a horizontal direction and is bent downwardly at a free end thereof to form a tail. The spring arm can deform to provide an elastic force for the tail to press against the printed circuit board.
申请公布号 US7976325(B2) 申请公布日期 2011.07.12
申请号 US20090536496 申请日期 2009.08.06
申请人 HON HAI PRECISION IND. CO., LTD. 发明人 HSIAO SHIH-WEI;LIN WEI-CHIH
分类号 H01R11/22 主分类号 H01R11/22
代理机构 代理人
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