发明名称 Photosensitive resin composition, photosensitive resin laminate, and method for pattern forming
摘要 A photosensitive resin composition, a photosensitive resin laminate, and a method for forming a pattern capable of realizing high hardness while using an epoxy group-containing acrylic resin are provided. In a photosensitive resin composition including (A) an epoxy group-containing acrylic resin, (B) a photopolymerization initiator, and (C) a sensitizer, an onium salt having a specific structure is used as the component (B), and at least one kind selected from 1,5-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, and 2,6-dihydroxynaphthalene is used as the component (C).
申请公布号 US7977030(B2) 申请公布日期 2011.07.12
申请号 US20080136354 申请日期 2008.06.10
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 SENZAKI TAKAHIRO;MISUMI KOICHI;SAITO KOJI
分类号 G03F7/029;G03F7/11;G03F7/20;G03F7/30;G03F7/40 主分类号 G03F7/029
代理机构 代理人
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