发明名称 Semiconductor device, method of fabricating the same, and pattern generating method
摘要 A semiconductor device according to an embodiment of the present invention has: a semiconductor substrate; an interlayer insulating film formed above the semiconductor substrate; a protective film formed on the interlayer insulating film, the protective film having a higher density than that of the interlayer insulating film; at least one of a wiring and a dummy wiring formed in the interlayer insulating film and the protective film; and a separation wall formed within the interlayer insulating film so as to surround a low density region to separate the low density region from other regions, a sum of covering densities of the wiring and the dummy wiring being lower than a predetermined prescribed value in the low density region.
申请公布号 US7977795(B2) 申请公布日期 2011.07.12
申请号 US20070619338 申请日期 2007.01.03
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 HIGASHI KAZUYUKI;MATSUNAGA NORIAKI
分类号 H01L23/48;H01L23/52;H01L29/40 主分类号 H01L23/48
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