Flexible multilayer printed circuit assembly with reduced EMI emissions

摘要

A flexible multilayer printed circuit assembly with shield fences. The flexible multilayer printed circuit assembly with multiple conductive layers includes logic ground vias that connect logic ground plane layers together, and shield vias that connect a top and a bottom shield plane layer together. Each of the shield fences is formed between the shield vias on an outside perimeter of each of the conductive layers. Each of the shield fences contains the logic ground vias inside, and also contains each corresponding conductive layer in the horizontal direction to which each layer extends.