| 摘要 |
A method of manufacturing a semiconductor package includes providing a carrier, forming a post slot and a terminal slot in the carrier, depositing a post in the post slot, depositing a terminal in the terminal slot, forming an encapsulant slot in the carrier, wherein the post extends into and is located within a periphery of the encapsulant slot and the terminal extends into the encapsulant slot, mechanically attaching a semiconductor chip to the post, electrically connecting the chip to the terminal, depositing an encapsulant in the encapsulant slot, and removing the carrier from the terminal. |
