SEMICONDUCTOR DEVICE

摘要

PURPOSE: A semiconductor device is provided to prevent resin fracture and to enhance quality of a semiconductor device by making it possible to support corners of a sealed body with a wide flattening part of a cutting die. CONSTITUTION: A semiconductor chip(2) has a plurality of electrodes formed on a front side and a backside. A chip loading part(1e) includes the second surface and the second backside. A plurality of leads are arranged around the chip loading part, and include the third surface and the third backside. A plurality of wires respectively connects a plurality of electrodes to a plurality of corresponding leads. A sealing body includes an upper side, a lower side and plural sides between the upper side and the lower side. The sealing body seals a part of a suspending lead and the plural leads.