| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board excellent in the flatness of an upper surface, and a method of manufacturing the same. SOLUTION: The multilayer wiring board is composed by alternately laminating a plurality of resin insulating layers 1 and a plurality of thin-film conductor layers 2 and electrically connecting the upper and lower thin-film conductor layers 2 with each other through a through conductor 3 formed on the resin insulating layer 1. The thin-film conductor layer 2 is housed inside a groove part 4 formed in the same pattern as the thin-film conductor layer 2 on the lower surface of the resin insulating layer 1 laminated on the upper side. The through conductor 3 is formed passing through the resin insulating layer 1 in the thickness direction so that a part of the lower part of the side face is exposed along the inner side face of the groove part 4, a part of the lower part of the side face exposed inside the groove part 4 of the through conductor 3 and the side face of the thin-film conductor layer 2 are brought into contact with each other, and the through conductor 3 and the thin-film conductor layer 2 are electrically connected. Since the thin-film conductor layer 2 is housed inside the groove part 4 and the side face of the through conductor 3 is in contact with the side face of the thin-film conductor layer 2, the deformation of the resin insulating layer 1 on the upper side is suppressed and the flatness is improved. COPYRIGHT: (C)2011,JPO&INPIT |
