发明名称 SUBSTRATE HEAT TREATMENT APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate heat treatment apparatus that removes water accumulated in a throat in a short period of time, increases a production rate of products, and reduces defects in device characteristics. SOLUTION: The substrate heat treatment apparatus includes a heat treatment furnace 2 for executing wet processing substrates carried into the inside of a process tube 22 through a throat 23 provided at the bottom of the heat treatment furnace, an opening and closing door for openably closing the throat 23, a load space 3 provided below the heat treatment furnace 2, an elevating lift 5 that carries the substrates into the inside of the process tube 22 from the side of the load space 3 through the throat 23 while holding them by a boat 4 and carries out the substrates from the process tube 22 to the load space 3, a purge-gas feeder 32 for supplying purge gas to the inside of the process tube 22, and a vacuum unit 30 that makes the inside of the process tube 22 vacuum so as to lower the boiling point of liquid generated by wet processing. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011134793(A) 申请公布日期 2011.07.07
申请号 JP20090291133 申请日期 2009.12.22
申请人 KOYO THERMO SYSTEM KK 发明人 NAGASHIMA YOICHI
分类号 H01L21/31 主分类号 H01L21/31
代理机构 代理人
主权项
地址
您可能感兴趣的专利