LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A light emitting device, a light emitting device package and a light emitting device manufacturing method thereof are provided to enhance physical properties like strength and electric conductivity. CONSTITUTION: The first conductive support member(165) is formed on the second conductive support member(165). A bonding layer(159) is formed on the first conductive support member. A diffusion preventing layer(158) is formed on the bonding layer. A light emitting structure(145) emits the light. An ohmic layer(156) is located under the light emitting structure. A channel layer(155) is formed according to the external circumference of the ohmic layer. A bonding layer is formed under the ohmic layer and the channel layer.