| 摘要 |
<p>PURPOSE: A wire bonding apparatus is provided to minimize the height of wire loop by physically pressing down a protruded wire to the bottom of a capillary in bonding a wire through a wire pressing unit. CONSTITUTION: In a wire bonding apparatus, a capillary(130) is mounted to be linked with a bonding head unit(120). The capillary receives a wire released from a spool. A clamp(134) is mounted between the spool and the capillary. A head body(122) controls the vertical and horizontal reciprocating motion of the capillary A wire pressing unit(140) is mounted to be linked with the bonding head unit.</p> |
