| 摘要 |
PURPOSE: An epoxy resin composition for encapsulating a semiconductor device is provided to maintain fluidity, moldability and fire retardancy, to ensure excellent adhesive force to various lead frames and cracking resistance. CONSTITUTION: An epoxy resin composition for encapsulating a semiconductor device comprises an epoxy resin, hardener, curing accelerator, inorganic filler, coupling agent, and 4-tert-butylphenol of chemical formula 1. The 4-tert-butylphenol is used in the amount of 0.01-2 weight% based on the total weight of the epoxy resin composition. The epoxy resin comprises one or more of a phenolaralkyl type epoxy resin represented by chemical formula 2 and a biphenyl type epoxy resin represented by chemical formula 3.
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