| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film pasting method to a wafer, and its equipment, which can flatten a dry film pasted on the surface of the wafer. <P>SOLUTION: The film pasting method to the wafer includes a film temporary cutting step 11, a film temporary pasting step 12, a film pressing step 13, and a film flattening step 14 in order. The film pasting equipment includes a film cutting mechanism 2 for temporarily cutting the dry film and temporarily pasting a cut dry film, a film pressing mechanism 3 for performing primary pressing of the wafer and the dry film, and a film flattening mechanism 4 for flattening the surface of the dry film of the wafer by performing secondary pressing of the wafer and the dry film. <P>COPYRIGHT: (C)2011,JPO&INPIT |
