| 摘要 |
Semiconductor packages and methods for making and using the same are described. The semiconductor packages contain a leadframe having an array of holes with a layout corresponding to the land pad array of the package, wherein the holes contain a thermally-conductive dielectric material with a via therein containing an electrically conductive material. The electrically conductive materials can extend past the bottom of the leadframe to form the land pad array of the packages. With such a configuration, the leadframe can act as an embedded heat sink in the package and there is no need to mount an additional heat sink to the package for thermal dissipation, allowing a thinner package to be manufactured. With such a configuration, the semiconductor packages have a full land pad array, providing a smaller footprint and a higher I/O capacity. Other embodiments are also described.
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