发明名称 CIRCUIT BOARD ASSEMBLY
摘要 A circuit board assembly is provided, includes a circuit board having a first side and a second side opposite to the first side. A chip is connected to the first side of the circuit board. A first heat dissipating device is located on the first side of the circuit board. The chip is located between the first heat dissipating device and the first side of the circuit board. A second heat dissipating device abuts the second side of the circuit board, and the second heat dissipating device are secured to the first heat dissipating device to clamp the circuit board and the chip.
申请公布号 US2011164380(A1) 申请公布日期 2011.07.07
申请号 US20100750927 申请日期 2010.03.31
申请人 HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 WU JENG-DA;CHAO CHIH-HANG;WU ZHI-PING
分类号 H05K7/20 主分类号 H05K7/20
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