| 摘要 |
The invention relates to an electrical component having at least one cable element, at least one solder joint, at least one hotmelt element and at least one substrate element. The cable element is connected with the substrate element by the solder joint. To improve the data transmission rate, the at least one solder joint is not embedded in the hotmelt element. Preferably, the solder joint is free from the hotmelt material of the hotmelt element. The invention is also concerned with a method of manufacturing such an electrical component. According to the inventive method, a flow of hotmelt material is stopped before it reaches the solder joint. Finally, the invention is concerned with providing a tool for manufacturing the electrical component. Here, a hotmelt cavity for forming the hotmelt element from hotmelt material is separated from a substrate cavity adapted to receive the substrate element by a compressible solder sealing.
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