| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is excellent in heat conductivity and connection reliability, and can achieve thin film, and specifically to provide the semiconductor device having an LED semiconductor element mounted thereon. <P>SOLUTION: The semiconductor device includes a conductive metal layer pattern in which an LED semiconductor element is mounted and a conductive metal layer pattern to which the LED semiconductor element is connected, and includes a reflector member outside from the LED semiconductor element, wherein the LED semiconductor element and the conductive metal pattern are sealed with a sealing material inside from the reflector member. In the semiconductor device, the conductive metal layer pattern is exposed, but is partly buried in the sealing material in the thickness direction of the conductive metal layer pattern on the semiconductor element mounting surface side at least on a portion other than the side surface of the semiconductor device. <P>COPYRIGHT: (C)2011,JPO&INPIT |
