SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, WIRING BASE MATERIAL FOR CONNECTING SEMICONDUCTOR ELEMENT, WIRING BOARD FOR MOUNTING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which is thinned as a first characteristic and has excellent high connection reliability as a second characteristic.

SOLUTION: There is provided the semiconductor device including a conductive metal layer pattern having a semiconductor element electrically connected thereto and a conductive metal layer pattern for wiring via a die-bonding material on the lower part of the semiconductor element, wherein the patterns are sealed with a sealing resin. In the semiconductor device, the conductive metal layer patterns are partly exposed to protrude in the thickness direction. The amount of protrusion of the conductive metal layer is a thickness of 1 μm or more in the thickness direction and 1/2 or less of the thickness of the metal layer, and a portion with the maximum width of a cross sectional shape is buried in the sealing material or the die-bonding material.

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