| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition with which variation in a pattern dimension in a substrate surface can be reduced. <P>SOLUTION: The positive photosensitive resin composition comprises a resin having a predetermined structure as a main component, a photosensitive agent, and a solvent, wherein the photosensitive agent contains a compound which is an esterification product of a phenol compound represented by general formula (2) and naphthoquinone diazide sulfonic acid, wherein 85 mol% or more of phenolic hydroxyl group in general formula (2) is esterified with naphthoquinone diazide sulfonic acid. In general formula (2), R<SP>5</SP>represents hydrogen or a monovalent 1-20C organic group, and R<SP>6</SP>-R<SP>8</SP>each independently represent hydrogen or a monovalent 1-20C organic group. However, at least one of (5-a) R<SP>6</SP>, (5-b) R<SP>7</SP>, and (5-c) R<SP>8</SP>is a monovalent ≥6C organic group including a phenolic hydroxyl group. a, b, and c each independently express integers of 1-4. <P>COPYRIGHT: (C)2011,JPO&INPIT |
