SEMICONDUCTOR WAFER, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

Disclosed is a semiconductor wafer provided with: a semiconductor substrate having a first surface and a second surface on the opposite side of the first surface wherein multiple circuit elements are formed on the first surface and a first scribe line area is disposed between the areas where said circuit elements are formed; an insulating film formed on the second surface side of the aforementioned semiconductor substrate; and wiring formed on the aforementioned insulating film. A second scribe line area is provided on the aforementioned second surface side of the aforementioned semiconductor substrate along the aforementioned first scribe line area in an area where the aforementioned insulating film has not been formed.