PROTECTIVE FILM FOR ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, AND USE THEREOF

摘要

Disclosed is a protective film for an electronic component comprising a base material containing a heat resistant resin and an adhesive layer formed on the base material containing an ethylene-unsaturated carboxylic acid copolymer or a metal salt thereof, wherein the ethylene-unsaturated carboxylic acid copolymer or the metal salt thereof contains 3 to 30% by weight of the structural unit derived from an unsaturated carboxylic acid.