METHODE FOR PREPARING PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method for manufacturing a printed circuit board is provided to increase the adhesive strength between an insulator and a circuit pattern, thereby effectively realizing a micro circuit pattern. CONSTITUTION: An adhesive(12) is attached onto an insulator(11) for a printed circuit board. A through hole(21) is formed in the insulator. A metal seed layer(22) is formed on one side or both sides of the insulator by a vacuum deposition method. A plating resist(31) is formed on one side or both sides of the insulator. Electroplating is performed based on a circuit pattern. The plating resist is eliminated.