Thermally Conductive Silicone Composition And Semiconductor Device

摘要

A thermally conductive silicone composition comprises (A) an organopolysiloxane having a viscosity equal to or greater than 100 mPa�s at 25� C.; (B) aluminum powder having an average size of particles ranging from 0.1 to 100μm; (C) zinc oxide powder having an average size of particles ranging from 0.05 to 50μm; (D) (i) an organopolysiloxane containing univalent hydrocarbon groups which have unsaturated aliphatic bonds, (ii) an organopolysiloxane containing hydrocarbon groups which are free of unsaturated aliphatic bonds, or a mixture of constituents (i) and (ii); and (E) a silane compound or a product of partial hydrolyzation and condensation of said silane compound. The composition has high conductivity and excellent handleability.