发明名称 LIGHT EMITTING DIODE PACKAGING STRUCTURE
摘要 <p>A LED packaging structure is provided, which includes: a cavity (21), a metal shell (2) with two opening ends, a two-phase flow heat conducting device (4) with a mounting plane (41); a lens (3) is fixed at a first opening end of the metal shell (2); at least one LED chip (1) is located in the cavity (21) of the metal shell (2) and fixed on the mounting plane (41) of the two-phase flow heat conducting device (4); an external electric connection device (5) is connected with the LED chip (1); a fixing seat (6) is fixed with the two-phase flow heat conducting device (4), the external electric connection device (5) and the LED chip (1). By adopting a two-phase flow heat conducting device, the structure can work continuously for a long time, and has long service life and high light emitting efficiency.</p>
申请公布号 WO2011079545(A1) 申请公布日期 2011.07.07
申请号 WO2010CN70629 申请日期 2010.02.11
申请人 ZHONGSHAN WEIQIANG TECHNOLOGY CO., LTD.;LEE, KECHIN 发明人 LEE, KECHIN
分类号 H01L33/00;H01L23/427;H01L23/467;H01L23/473 主分类号 H01L33/00
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