| 摘要 |
<p>PURPOSE: A dry film photo-resist is provided to prevent the generation of a transferring operation to a photo-sensitive resin layer due to the irregular surface of a supporting film by implementing an exposure operation without the supporting film. CONSTITUTION: A supporting film, a resin protective layer, and a photo-sensitive resin layer are successively stacked to form a dry film photo-resist. The depth of a groove(Rv) is less than or equal to 200nm on the surface of the resin protective layer. The thickness of the resin protective layer is thinner than or equal to 10um. The haze of the resin protective layer is lower than or equal to 3.0%. The developing time of the resin protective layer per 1um is shorter than or equal to 10 seconds.</p> |
