| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain an electronic element having a plurality of films, wherein the electronic element can cope with stress relaxation to a film which causes expansion or contraction even a change in material during high-temperature heat treatment in a manufacture process of a semiconductor or the like. <P>SOLUTION: The method for manufacturing the electronic element includes: a film forming step of forming a film showing expansion/contraction property under predetermined temperature on a film showing heat flow property under the predetermined temperature; and a heat treatment step of performing heat treatment at temperature equal to or above the predetermined temperature after the film forming step. The electronic element has a film showing heat flow property under predetermined temperature, and a film showing expansion/contraction property under the predetermined temperature formed on the film showing the heat flow property, and is obtained by forming the film showing the expansion/contraction property, and then performing the predetermined heat treatment thereto. <P>COPYRIGHT: (C)2011,JPO&INPIT |
