| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of producing a chip component from a plate material obtaining a light emitting device efficiently emitting a light ray from an inside of a sapphire layer to exhibit high luminance performance. <P>SOLUTION: Laser processing is performed by irradiating a light emitting device material 1 that includes a sapphire substrate layer 2A and a light emitting layer 3A and many almost square light emitting device regions 4A are sectioned on the sapphire substrate layer 2A along scheduled division lines 9 with a laser beam which is zigzag scanned along the scheduled division lines 9. Then, external force is exerted onto a process locus for laser processing to divide the light emitting device material 1 into many light emitting devices 4. Since a side surface 2f of a sapphire layer 2 of the light emitting device 4 has a corrugated shape, the number of total reflections on the side surfaces of the sapphire layer can be reduced to thereby achieve efficient emergence of light from the sapphire layer 2. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
