| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device in which an abrasive does not deposit and solidify in a polishing liquid supply system and a polishing device for facilitating quantitative control of the abrasive and having an increased amount of the fed liquid. SOLUTION: In the polishing device, the polishing liquid supply system includes a first supply path 30A comprising a first sub-tank T2A for temporarily storing a constant amount of the polishing liquid, an open/close valve and a pipe, a second supply path 30B comprising a second sub-tank T2B for temporarily storing a constant amount of the polishing liquid, an open/close valve and a pipe, and a cleaning path 50 comprising a liquid feed path and a liquid discharge path for alternately cleaning the first supply path and the second supply path. A metering pump for pressure-feeding to a dropping nozzle comprises a diaphragm pump P4, and a disk filter DF is provided toward the dropping nozzle N. COPYRIGHT: (C)2011,JPO&INPIT |
