| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for preventing an outer edge of the fillet of an underfill for sealing a semiconductor chip from abutting on electronic components even if an interval between the semiconductor chip and the other electronic components becomes small and they approach, and for achieving high-density flip-chip packaging. SOLUTION: In the semiconductor device for sealing an area between the semiconductor chip 2 and an interposer 7 by using the underfill 9, a notching section 4 having a horizontal width W<SB>1</SB>of 10-100μm having a surface facing the side of an interposer 7 instead of a horizontal direction is provided at least at one portion of an end face section 3 of the semiconductor chip 2. COPYRIGHT: (C)2011,JPO&INPIT |
