发明名称 FLOW TUBE APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a flow tube apparatus etc., capable of cooling electronic components and circuits not by mechanical components such as a heat sink and a fan. SOLUTION: The flow tube apparatus may include a flow tube having a first opening and a second opening, a corona electrode provided in the flow tube, and a collecting electrode and at least one focusing electrode. The focusing electrode guides ions and thereby provides an ionic wind. In at least one embodiment, the flow tube apparatus may be provided in an electronic apparatus to provide an air flow. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011135074(A) 申请公布日期 2011.07.07
申请号 JP20100279125 申请日期 2010.12.15
申请人 INTEL CORP 发明人 MACDONALD MARK;MONGIA RAJIV K;GO DAVID B
分类号 H05K7/20;H01T19/00 主分类号 H05K7/20
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