发明名称 FLOOR STRUCTURE USING PANEL FOR FLOOR ASSEMBLY, PANEL SET FOR FLOOR ASSEMBLY, AND METHOD OF FORMING FLOOR STRUCTURE USING THE PANEL SET
摘要 PROBLEM TO BE SOLVED: To provide a floor structure capable of preventing a covering material from being swelled or damaged without allowing an expanding stress to be concentrated to only the covering material positioned just above and between panels for a floor assembly. SOLUTION: In this floor structure, panels 1, 2 for floor assembly formed by joining the soft covering materials 1b, 2b onto the surfaces of panel bodies 1a, 2a with a first adhesive agent 3, respectively, are arranged in parallel with the gap 5 interposed between the panel bodies 1a, 2a. The covering material 1b of the first panel 1 is extended to the second panel 2 side, and the end of the covering material 2b of the second panel 2 on the first panel 1 side is cut off. The end edge of the covering material 1b of the first panel 1 and the end edge of the covering material 2b of the second panel 2 are made to abut on each other. At least the area of the extended covering material 1b of the first panel 1 positioned on the second panel body 2a is joined to the second panel body 2a with a second adhesive agent 4 having a higher flexibility than the first adhesive agent 3. A joint 6 portion where the end edge of the covering material 1b of the first panel 1 and the end edge of the covering material 2b of the second panel 2 abut on each other is sealed 7. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011132744(A) 申请公布日期 2011.07.07
申请号 JP20090293225 申请日期 2009.12.24
申请人 TAKIRON CO LTD 发明人 IGAKI FUMIHIRO;NISHIOKA JUNICHI
分类号 E04F15/00;E04D13/04;E04F15/02 主分类号 E04F15/00
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