| 摘要 |
PROBLEM TO BE SOLVED: To achieve a frame-package type semiconductor laser device that prevents the occurrence of deterioration in emission end face of a semiconductor laser element. SOLUTION: The semiconductor laser device is configured as follows. A semiconductor laser element 110 is fixed to a die pad 121 of a lead frame 120. An emission end face 111 of the semiconductor laser element 110 is covered with a translucent sealing member 140. COPYRIGHT: (C)2011,JPO&INPIT
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