| 发明名称 |
APPARATUS FOR FORMING SOLDER DAM |
| 摘要 |
An apparatus for forming a solder dam on each lead of an electronic device includes a mask having one or more slits; and forming means that forms the solder dam made of non-metal material on the lead of the electronic device through the slits of the mask. |
| 申请公布号 |
US2011165338(A1) |
申请公布日期 |
2011.07.07 |
| 申请号 |
US20100977641 |
申请日期 |
2010.12.23 |
| 申请人 |
FUJITSU LIMITED;FUJITSU COMPONENT LIMITED |
发明人 |
KITAJIMA MASAYUKI;NODA YUTAKA;KOBAYASHI HIDEHIKO;KUSAGAYA TOSHIHIRO;MIZUKAMI KAZUHIRO |
| 分类号 |
B05D1/32;B05B5/025;B05C11/00;B05D1/04;B05D5/00;C23C14/34;C25D5/02;C25D17/00 |
主分类号 |
B05D1/32 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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