MACHINING METHOD OF WORKPIECE, DIVIDING METHOD OF WORKPIECE, AND LASER BEAM MACHINING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a machining method for forming a dividing starting point in a workpiece by which optical absorption in a machining trace is reduced, efficiency of taking out light from sapphire is enhanced and high-speed processing can be performed, and to provide a laser beam machining apparatus that materializes this method.

SOLUTION: The workpiece is irradiated with a pulsed laser beam in such a manner that an irradiation region for each unit pulsed beam of an ultrashort pulsed laser beam is formed discretely on the workpiece. By an impact or a stress caused when an irradiation position is irradiated with each unit pulsed beam, cleavage or parting of the workpiece is successively generated between the irradiation regions, thereby forming on the workpiece a starting points for dividing.

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