发明名称 METHOD AND STRUCTURE FOR FORMING HIGH-PERFORMANCE FETS WITH EMBEDDED STRESSORS
摘要 A high-performance semiconductor structure and a method of fabricating such a structure are provided. The semiconductor structure includes at least one gate stack (18), e.g., FET, located on an upper surface (14) of a semiconductor substrate (12). The structure further includes a first epitaxy semiconductor material (34) that induces a strain upon a channel (40) of the at least one gate stack. The first epitaxy semiconductor material is located at a footprint of the at least one gate stack substantially within a pair of recessed regions (28) in the substrate which are present on opposite sides of the at least one gate stack. A diffused extension region (38) is located within an upper surface of said first epitaxy semiconductor material in each of the recessed regions. The structure further includes a second epitaxy semiconductor material (36) located on an upper surface of the diffused extension region. The second epitaxy semiconductor material has a higher dopant concentration than the first epitaxy semiconductor material.
申请公布号 WO2011037743(A3) 申请公布日期 2011.07.07
申请号 WO2010US48039 申请日期 2010.09.08
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;CHENG, KANGGUO;KHAKIFIROOZ, ALI;DORIS, BRUCE, B.;SHAHIDI, GHAVAM 发明人 CHENG, KANGGUO;KHAKIFIROOZ, ALI;DORIS, BRUCE, B.;SHAHIDI, GHAVAM
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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