发明名称 BACK SIDE ILLUMINATION IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME
摘要 PURPOSE: A backside light receiving image sensor and a manufacturing method thereof are provided to cut off electric cross talk by maintaining an electrically perfect isolation state. CONSTITUTION: Front side element isolation areas(300a,300b) is formed in the front of a substrate(100). A photodiode(120) is formed in an area defined as a front element isolation area. An interlayer insulating layer(160) and a wiring(140) are formed on the front of the substrate. Backside element isolation areas(200a,200b) are formed at a backside of the substrate and are connected to the front element isolation area. A micro lens(180) is formed in a backside of the substrate.
申请公布号 KR20110079337(A) 申请公布日期 2011.07.07
申请号 KR20090136355 申请日期 2009.12.31
申请人 DONGBU HITEK CO., LTD. 发明人 KO, HO SOON
分类号 H01L27/146 主分类号 H01L27/146
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