| 发明名称 |
SUBSTRATE FOR LED MOUNTING |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a novel substrate suitable for LED mounting. <P>SOLUTION: The substrate for LED mounting includes a heat conductive layer (a heat conductive sheet 10) that is formed from a composition containing a boron nitride powder and a fluorine resin. The fluorine resin contains polytetrafluoroethylene. The heat conductive layer has a heat conductivity of not less than 2 W/(m.K). The heat conductive layer has a reflectance of not less than 0.80 at wavelengths of 380 nm, 470 nm and 650 nm. <P>COPYRIGHT: (C)2011,JPO&INPIT |
| 申请公布号 |
JP2011135069(A) |
申请公布日期 |
2011.07.07 |
| 申请号 |
JP20100263957 |
申请日期 |
2010.11.26 |
| 申请人 |
NITTO DENKO CORP |
发明人 |
KITAGAWA DAISUKE;TAKAYAMA YOSHINARI;SUEHIRO ICHIRO;USUI HIDEYUKI;ODA TAKASHI |
| 分类号 |
H01L33/64;C08K3/38;C08L27/18;H01L33/60 |
主分类号 |
H01L33/64 |
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