发明名称 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To prevent defective operations by poor contact and short-circuit in a semiconductor light emitting device which holds an semiconductor light emitting element from both upper and lower sides with conductive substrates. <P>SOLUTION: The semiconductor light emitting device includes a semiconductor light emitting element constituted in the structure that a pair of substrates of the first substrate and the second substrate having conductivity at the front surfaces thereof are provided, the pair of substrates are arranged to provide the front surfaces to be faced with each other, and a n-type semiconductor and a p-type semiconductor are held in the upper and lower directions and electrically connected between these substrates. The second substrate is higher in flexibility than the first substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011134926(A) 申请公布日期 2011.07.07
申请号 JP20090293823 申请日期 2009.12.25
申请人 NICHIA CORP 发明人 FUJIKAWA YASUO;TAKEDA HIDEAKI
分类号 H01L33/52 主分类号 H01L33/52
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