发明名称 MULTIPLE PATTERNING WIRING BOARD AND WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board easily dividing a ceramic mother board into respective wiring board areas without generating burrs. <P>SOLUTION: On the multiple patterning wiring board 10, division grooves 6a, 6b are formed on a mother board 1 comprising a lower mother board 1b where a plurality of wiring board areas 2 are arrayed in a matrix and a frame-like upper mother board 1a. On one side of the wiring board area 2, the upper mother board 1a is not formed so that the upper surface of the lower mother board 1b is exposed to the boundary of the wiring board area 2, the wiring board areas 2 are arrayed so that the one side where the upper mother board 1a is not formed is continued adjacently, and the division groove 6b is formed on the upper surface of the lower mother board 1b in the part where the one side of the wiring board area 2 where the upper mother board 1a is not formed is continued adjacently. Since the division groove 6b is formed on the lower mother board 1b with a sufficient depth, the generation of burrs during division is suppressed. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011134826(A) 申请公布日期 2011.07.07
申请号 JP20090291908 申请日期 2009.12.24
申请人 KYOCERA CORP 发明人 AIKO YOHEI
分类号 H01L23/13;H01L23/08;H01L23/12;H05K1/02;H05K3/00 主分类号 H01L23/13
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